FMC
Recently, there has emerged a greater need for different front panel IO functionality within systems. Typically, this front panel IO functionality was fixed on 3U or 6U form factor cards, or it was configured with PMC or XMC modules. Previously, 3U and 6U form factor card design used a fixed front panel IO, which addressed a particular function. Changing the front panel IO functionality meant replacing the 3U or 6U cards. PMC and XMC modules provided configurable front panel IO for 3U and 6U form factor cards. However, PMC and XMC modules use much of the 3U and 6U carrier card area.
FPGA Mezzanine Card, or FMC, as defined in VITA 57 provides a specification describing a new I/O mezzanine module. The module will connect to, but not be limited to, 3U and 6U form factor cards. FMC modules use a smaller form factor compared with PMC or XMC modules, and assume connection to an FPGA or other device with reconfigurable I/O capability.
The objectives of the FMC specification are to define:
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Supporters of FMC:
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The FMC specification has two defined sizes that are referred to as a single width, and a double width module. The single width module has a width of 69mm and the double width module has a width of 139mm. The depth of both is 76.5mm. An example of a single wide module is shown above, and three single wide modules mounted on a carrier card is shown to the left.
The FMC mezzanine module uses a high-pin count 400 pin high-speed array connector, HPC. A mechanically compatible low-pin count, LPC, connector with 160 pins can also be used with any of the form factors detailed in this standard.
It is expected that the FMC will be used in a wide range of markets, environments, and carrier card form factors supporting a wide range of I/O interfaces. The standard describes options to create modules for operating in a range of environments from passively cooled to fully ruggedized conduction cooled.
