RITTAL / KAPAREL

Rittal / Kaparel
One Rittal Place
Springfield, OH 45504, USA
Telephone: (937) 399-0500
Fax: (9373) 390-5599
http://www.rittal-corp.com

Product Information: 1-800-35RIPAC
Order Desk: Traci Keaton
Marketing: Ken Dubois
Applications/Technical: Mike Kurimski

Sales Support Locations:
Germany, Tel: 02772 505 703, Fax: 02772 505 837
U.K., Tel: 01709-704000, Fax: 01709-701217
Canada, Tel: (905) 795-0777, Fax: (905) 795-9548
Japan: Tel: 3-3494-1151, Fax: 3-3494-1130

Rittal / Kaparel, the world's leading manufacturer of industrial and electronic packaging systems, is known worldwide for innovation and quality. Rittal Ripac is an advanced generation of 19 inch subracks, VME backplanes and VME systems. Ripac design offers a host of features that give VME systems engineers what they want most - superior performance at a competitive price: Maximum airflow design / EMC, ESD and keying solutions / self locking injector/ejector handles for connector insertion/extraction forces over 100 lbs - optional microswitches for live insertion applications / VME64 and VME64 Extension system solutions / VME64 and VME64 Extension high performance backplanes.

Products listed in the following categories: Backplanes, Card Rack Hardware and Accessories, Powered Enclosures, Connectors/Board Accessories

Backplanes

Configuration Description Size

J1/J2 (P0)
Monolithic VME64Extension, 12 layer with 160 pin J1 and J2 and optional P0 connector .

J1/J2
Monolithic VME64, 10 layer, 2 to 21 slot. For transfer rates greater than 20MB/s (and high performance bus transceivers). Auto Bus Grant Connectors .

J1/J2
Monolithic VME64, 6 layer, 2 to 21 slot. High performance VME backplane, Auto Bus Grant Connectors .

J1 VME64, 6 layer, 2 to 21 slot. High performance VME backplane, Auto Bus Grant Connectors .

J2 VME, 2 layer, 2 to 21 slot .

J1/J0/J2 Physics VME64x CDF Backplane, J1/J0/J2 high performance physics backplane with Electronic Bus Grant 6U+

J1/J0/J2 Physics VME64x with P Connections, J1/J0/J2 high performance physics backplane with Electronic Bus Grant 6U+

VSB 4 layer, 2 to 6 slot, J2 piggyback version .

J2/J3 General purpose backplanes provide power per VME J2 row b requirements, 2 to 21 slot .

J3 Unbussed Backplane, 2 to 21 slot .

Extenders VME64 Backplane Test Adaptors / Extenders 3U
6U
9U

Configuration	Description	Size
J1/J2 (P0) Monolithic	VME64Extension, 12 layer with 160 pin J1 and J2 and optional P0 connector	.
J1/J2 Monolithic	VME64, 10 layer, 2 to 21 slot. For transfer rates greater than 20MB/s (and high performance bus transceivers). Auto Bus Grant Connectors	.
J1/J2 Monolithic	VME64, 6 layer, 2 to 21 slot. High performance VME backplane, Auto Bus Grant Connectors	.
J1	VME64, 6 layer, 2 to 21 slot. High performance VME backplane, Auto Bus Grant Connectors	.
J2	VME, 2 layer, 2 to 21 slot	.
J1/J0/J2	Physics VME64x CDF Backplane, J1/J0/J2 high performance physics backplane with Electronic Bus Grant	6U+
J1/J0/J2	Physics VME64x with P Connections, J1/J0/J2 high performance physics backplane with Electronic Bus Grant	6U+
VSB	4 layer, 2 to 6 slot, J2 piggyback version	.
J2/J3	General purpose backplanes provide power per VME J2 row b requirements, 2 to 21 slot	.
J3	Unbussed Backplane, 2 to 21 slot	.
Extenders	VME64 Backplane Test Adaptors / Extenders	3U 6U 9U

Cardrack Hardware/Accessories

Function Description Size

Subrack
IEEE 1101.1 Ripac Economy, compatible with IEEE, DIN and IEC Standards, Extruded side plates, Custom configurations, Commercial, Rugged versions 3U
6U
9U

Subrack
IEEE 1101.10 Ripac Vario, compatible with IEEE, DIN and IEC Standards, EMC upgradable, Custom configurations, 2/3/4/6/7/9/10/11U .

Subrack
IEEE 1101.10 Ripac EMC, compatible with IEEE, DIN and IEC Standards, best EMC solution, Custom configurations, 2/3/4/6/7/9/10/11U .

Subrack Ripac Vario for horizontal Drive Chassis, Rugged 2U
4U
6U

Subrack Ripac Physics, compatible with VIPA, VME64x and Physics requirements, Rugged 7U

Subrack Ripac Physics, compatible with VIPA, VME64x and Physics requirements, Rugged 10U

Front Panels
IEEE 1101.1 Non EMC. Modification Service, cut-outs, plating, printing, etc. Injector/Ejector easy assembly handles with keying, ESD and optional microswitch live insertion features, self locking 2U to
11U

Front Panels
IEEE 1101.10 EMC. Modification Service, cut-outs, plating, printing, etc. Injector/Ejector easy assembly handles with keying, ESD and optional microswitch live insertion features, self locking 2U to
11U

Plug-in
Units Clam Shell and Box Type 3U
6U
9U

Fan
Trays 19 in. and subrack mountable with optional speed control 1U

Drive
Chassis Horizontal for 3.5 in., 5.25 in. and CD-ROM, Rugged 2U

Drive
Chassis Vertical for 3.5 in., 5.25 in., and CD-ROM 3U
4U
6U

Function	Description	Size
Subrack IEEE 1101.1	Ripac Economy, compatible with IEEE, DIN and IEC Standards, Extruded side plates, Custom configurations, Commercial, Rugged versions	3U 6U 9U
Subrack IEEE 1101.10	Ripac Vario, compatible with IEEE, DIN and IEC Standards, EMC upgradable, Custom configurations, 2/3/4/6/7/9/10/11U	.
Subrack IEEE 1101.10	Ripac EMC, compatible with IEEE, DIN and IEC Standards, best EMC solution, Custom configurations, 2/3/4/6/7/9/10/11U	.
Subrack	Ripac Vario for horizontal Drive Chassis, Rugged	2U 4U 6U
Subrack	Ripac Physics, compatible with VIPA, VME64x and Physics requirements, Rugged	7U
Subrack	Ripac Physics, compatible with VIPA, VME64x and Physics requirements, Rugged	10U
Front Panels IEEE 1101.1	Non EMC. Modification Service, cut-outs, plating, printing, etc. Injector/Ejector easy assembly handles with keying, ESD and optional microswitch live insertion features, self locking	2U to 11U
Front Panels IEEE 1101.10	EMC. Modification Service, cut-outs, plating, printing, etc. Injector/Ejector easy assembly handles with keying, ESD and optional microswitch live insertion features, self locking	2U to 11U
Plug-in Units	Clam Shell and Box Type	3U 6U 9U
Fan Trays	19 in. and subrack mountable with optional speed control	1U
Drive Chassis	Horizontal for 3.5 in., 5.25 in. and CD-ROM, Rugged	2U
Drive Chassis	Vertical for 3.5 in., 5.25 in., and CD-ROM	3U 4U 6U

Powered Enclosures

Configuration Available
Slots Description Size

Ripac
VME64 5 to 21 19 in. Rack mount, over 50 configurations. Fully configured with power and cooling. Industrial mounting panel versions. Modification service (CompactPCI), 3/4/6/7/9/10/11U .

Ripac
VME64
Extensions 5 to 21 19 in. Rack mount, over 50 configurations. Fully configured with power and cooling. Industrial mounting panel versions. Modification service (CompactPCI), 3/4/6/7/9/10/11U .

Physics
Subrack
System . J1/J0/J2 VME64x with P Connections Backplane. Front mountable 7Ux160mm PCBs and rear mountable 6Ux80mm Transition Modules. Inclusive Bulk Head for power connections, Rugged 7U

Physics
Subrack
System . J1/J0/J2 VME64x with P Connections Backplane. J3 user defined. Front mountable 9Ux400mm PCBs and rear mountable 9Ux120mm Transition Modules. Inclusive Bulk Head for power connections, Rugged 10U

Physics
Subrack
System . J1/J0/J2 VME64x CDF Backplane. J3 user defined. Front mountable 9Ux400mm PCBs and rear mountable 9Ux120mm Transition Modules. Inclusive Bulk Head for power connections, Rugged 10U

Configuration	Available Slots	Description	Size
Ripac VME64	5 to 21	19 in. Rack mount, over 50 configurations. Fully configured with power and cooling. Industrial mounting panel versions. Modification service (CompactPCI), 3/4/6/7/9/10/11U	.
Ripac VME64 Extensions	5 to 21	19 in. Rack mount, over 50 configurations. Fully configured with power and cooling. Industrial mounting panel versions. Modification service (CompactPCI), 3/4/6/7/9/10/11U	.
Physics Subrack System	.	J1/J0/J2 VME64x with P Connections Backplane. Front mountable 7Ux160mm PCBs and rear mountable 6Ux80mm Transition Modules. Inclusive Bulk Head for power connections, Rugged	7U
Physics Subrack System	.	J1/J0/J2 VME64x with P Connections Backplane. J3 user defined. Front mountable 9Ux400mm PCBs and rear mountable 9Ux120mm Transition Modules. Inclusive Bulk Head for power connections, Rugged	10U
Physics Subrack System	.	J1/J0/J2 VME64x CDF Backplane. J3 user defined. Front mountable 9Ux400mm PCBs and rear mountable 9Ux120mm Transition Modules. Inclusive Bulk Head for power connections, Rugged	10U

Test and Diagnostic

Function Description ADDR/
DATA
Width Size

Extender Boards
J1 160/220/280mm, all VME signal and control lines switched, with test points . 3U

Extender Boards 220/280mm generic, busses all 96 lines. Each line switched, with test points . 3U

Extender Boards
J2 160/220/280mm, all VME signal and control lines switched, with test points . 3U

Extender Boards
J1/J2 160/220/280mm, all VME signal and control lines. Each line switched, with test points . 6U

Extender Boards 160/220/280mm generic, busses all 96 lines. Each line switched, with test points . 6U

Extender Boards
J1/J2/J3 160/220/280mm, all VME signal lines and control lines. Each line switched, with test points . 9U

Function	Description	ADDR/ DATA Width	Size
Extender Boards J1	160/220/280mm, all VME signal and control lines switched, with test points	.	3U
Extender Boards	220/280mm generic, busses all 96 lines. Each line switched, with test points	.	3U
Extender Boards J2	160/220/280mm, all VME signal and control lines switched, with test points	.	3U
Extender Boards J1/J2	160/220/280mm, all VME signal and control lines. Each line switched, with test points	.	6U
Extender Boards	160/220/280mm generic, busses all 96 lines. Each line switched, with test points	.	6U
Extender Boards J1/J2/J3	160/220/280mm, all VME signal lines and control lines. Each line switched, with test points	.	9U

Connectors

Description

DIN 41612, IEC 603-2

Type B, class 2. WW, Solder and Press-fit

Type C, class 2. WW, Solder and Press-fit

Type R, class 2. WW, Solder and Press-fit

Type H 11. Solder and Faston

Type H 15. Solder and Faston

Description
DIN 41612, IEC 603-2
Type B, class 2. WW, Solder and Press-fit
Type C, class 2. WW, Solder and Press-fit
Type R, class 2. WW, Solder and Press-fit
Type H 11. Solder and Faston
Type H 15. Solder and Faston

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