|
Subject |
Presenter |
Comments |
|
Call VSO meeting to order Introductions, Agenda Review Announcements, Minutes Approval |
Elwood Parsons, VSO Chair |
SecretaryÕs Note: The VSO meeting was condensed into a
long one day session because of schedule conflicts and the reluctance of
members to travel on the weekend.
Elwood asked members to introduce themselves. The minutes from the previous meeting
were approved as written. |
|
IP Issues -
Patent
Policy Review -
Call
for Patent Disclosures |
Elwood Parsons, VSO Chair |
Elwood reviewed the VSO patent policy procedure
and asked for patent disclosures.
None were made. |
|
Thermalworks Presentation - Composites |
Kris Vasoya, Thermalworks |
This was a shortened version of the Thermalworks
presentation from the MEECC.
The technology described involves the insertion of carbon
fiber layers in pc board fabrication in order to enhance heat transfer
and increase the stiffness of the boards. See presentation. |
|
VITA 17.2, 10 Gbit Serial FPDP Report |
Dean Holman, Mercury, for Ralph Barrera, Curtiss-Wright |
This is an activity that will expand the earlier 17.1 one
gigabit standard to higher data rates. Four channels will be used to accomplish this
but there is already anticipation of a 17.3 specification that will do
the 10 gigabit rate on a single link. A preliminary document has been sent out. Regular
teleconferences have begun. This
standard defines three speeds (2.5, 3.125 and 4.25 Gbps), multiple lane
options (1X, 2X, 4X, 6X, 8X and 12X) and XAUI compatibility on the front
panel data port. The
document stands at revision 0.3. The next major task is to do the
electrical transmit and receive characteristics tables. The group is looking for volunteers
to work on the electrical transmit/receive characteristics tables. David Pepper of GE volunteered to
check within his company for a volunteer. See Presentation. |
|
VITA 41.6, VXS Control Plane |
Jerry Palmer, DRS-SS |
Jerry is no longer with DRSS and Mike Bonato is replacing
him. Mike asked that he be
forwarded information regarding the committee members and the status of
the document. |
|
VITA 41.7, Processor Mesh |
Michael Monroe, Bustronics |
Melissa Heckman gave a brief status report in Mike's
absence. Mike sent out the
latest draft just today and is asking for comments. |
|
VITA 46, VPX Status Report |
Stewart Dewar, Curtiss-Wright |
Stewart Dewar presented the update. The base document, VITA 46.0, is
at draft 18 and the next version is in process. The sublevel documents statuses
were reported as: á
VITA 46.1 - The second ballot closed in December with 100%
approval. This will be held until the base document is ready for ANSI
submittal and both will be sent forward together. VITA 46.3 - Serial RapidIO on
VITA 46. The latest draft of
this, draft number 4, is out for comment. See Presentation.
VITA 46.4 - PCI Express/ASI on VITA 46.
This document stands at draft 2 which was just sent out this
month and the committee is awaiting comments. VITA 46.5 - Hypertransport on VITA 46. This is inactive and no further
action is planned at this time.
VITA 46.9 - XMC & PMC User I/O Mapping on VITA 46. Draft 0.1, dated may 2005, is
outdated but Jing Kwok is reviving it.
The key appendices, B.4 (PMC/XMC) and C.2 (PMC/3U VPX) are much
further along. VITA 46.10
- Rear Transition Modules. Ivan
Strasnicky is editing this.
The initial draft is out and a new revision is in process. VITA 46.20 - VPX Switch Slots. The first draft is expected to be
out in 2 to 3 weeks. The open issues on VITA 46 involve the testing
of the 50 microinch gold plated connectors that showed no wear through
improvement over the 30 microinch parts in vibration testing. Tyco is evaluating the test
samples, the plating choice for the alignment/keying modules which were
recently tested for 48 hours salt fog exposure in an enclosed
condition. The initial 500
hour exposure was determined to be excessive. The group also needs a solution for backplane I/O via
direct attach cabling. Tyco
has promised to look into it, but has no product available at this
time. VITA 46 has been the subject of significant industry communication
and promotion. See
Presentation. |
|
*** BREAK *** |
|
|
|
VITA 47 Revisions |
Jim Robles, Boeing |
Boeing is proposing a revision to the VITA 47
environmental standard. They
want to address more stringent environmental conditions for the smaller
3U high modules. These
include vibration and shock, higher edge temperatures for conduction
cooling, spray cooling capabilities and corrosion resistance testing
done on other VITA architectures. |
|
VITA 48, ERDI |
Mike Gust, Mercury Computer |
The VITA 48 committee (REDI) has four standards in
progress. The
base specification, and the air and conduction cooled
preliminary sub-specifications have been balloted and the liquid cooled
document is ready for its initial review. Comments from previous ballots have been incorporated
into the documents and another review is in process. An update and editing session
were part of this meeting.
Issues still plaguing the committee involve insertion/extraction
mechanisms, guidance provided by the quick disconnect fluid connectors,
flow rates in these devices versus the rates required by higher wattage
modules, mixing different width modules in a cage, rigidity of cages and
the ability of the system to accommodate high mating force modules
without loss of electrical connectivity or leakage in the fluid connections. Tolerance analyses of the
conduction and liquid cooled systems were reviewed and there is
some concern about the robustness of the MultiGig connectors since both
cooling methods impart additional stresses on them. Mercury is conducting an extensive
series of tests on the Tyco MultiGig connectors to evaluate the limits
of misalignment that can be tolerated during mating. This is necessary because of the
restraints imposed by the guide pin/fluid quick disconnect
mechanisms. See Presentation. |
|
VITA 49, Digital IF |
Bob Normoyle, DRS-SS |
This is a data structure standard for passing a radio's
digitized intermediate frequency data between system elements. An update was given. The basic
document will define the streaming data packet, context packet and
definable context packet and was sent to the working group for review in
December. An initial working
group ballot is anticipated in September. See Presentation. |
|
VITA 50, Cooling |
Mike Benjamin, Parker Hannifin |
The Cooling Practices Handbook effort (VITA 50) has not
made much progress since the last meeting. This has, however, taken on an increased urgency with
the upswing in interest in VITA 46/48 and faster progress is
promised. This is an enormous effort since the document is to be a guide
to "what can be done, not how to do it" in cooling and will
include the entire spectrum of cooling technologies. The preliminary draft will emphasize
liquid cooling techniques.
The document will also contain a section that allows designers to
rapidly screen various cooling techniques and narrow the options to a
select few by answering a very few incisive questions. The committee is
looking for descriptive information on heat exchangers, fans, heat
pipes, spray cooling, cold plates, pumps, fluids, etc. Technical details
should be part of the information supplied. Attribution of the contributing company would be
included. Examples of the type
of information desired are shown on the VITA 50 website. The format of the document may
be changed to focus primarily on using internet search terms instead of
actual lengthy content. There
will be three primary areas: components, systems and analysis. The
ultimate scenario would result in system level descriptions that
evaluate the cooling techniques in terms of watts/gram, watts/cc, watts
of cooling power/watts of input power and watts/dollar. See Presentation. |
|
VITA 51, Reliability Prediction |
Charles Falardeau, Curtiss-Wright |
Elwood Parsons, Foxconn, for Lori Bechtol,
Boeing. Reliability Prediction (VITA 51) is a committee working on a replacement for
the no longer maintained Mil Handbook 217. They are trying to produce a comprehensive resource
that will allow systematic reliability projections for electronic
equipment. The original military
handbook has not been revised in 10 years. This new standard will update the methodology
and techniques used in such predictions. Most of the activity since
the last meeting on this topic has involved coordination with outside
groups which are also working on reliability prediction. This group is extremely active in
both telecom working sessions and promotion of and coordination of the
effort with other organizations.
They will hold their next working group session in September. See Presentation. |
|
VITA 53, Market Surveillance |
Steven Cecil, CRANE |
VITA 53 is attempting to develop a method to control
obsolescence awareness of COTS material within the Department of
Defense. This committee
is trying to provide a mechanism whereby suppliers can inform the buyer
of their anticipated plans as regards product lifespan. The buyers can then develop
contingency plans to find alternate sources of these key systems or find
replacement technology before the need becomes critical. A draft of the standard has been
prepared and the chair is requesting review and comments. There are two sponsors for this
activity and the chair is looking for the third in order to progress to
working group status. See Presentation. |
|
VITA 55 Aurora on VME Report |
Andy Reddig, Tek Microsystems, Inc. |
No report
was given at this meeting. |
|
*** LUNCH *** |
|
|
|
Standards Report |
John Rynearson, Tech Dir VITA |
No report was given at this meeting. |
|
VITA Report |
Ray Alderman, Exec Dir VITA |
Ray gave an update on the VITA Board of Directors meeting,
especially as regards the proposed ex ante patent policy that the board
is considering for VITA. |
|
VITA 56, EMC |
David Slaton, GE |
VITA 56 is the live insertion mezzanine card standard,
similar to the highly popular PMC card but front insertable. A preliminary draft has
been prepared. Six
different documents are currently anticipated. Initial work is being concentrated on the ability of
the connector to survive Telcordia GR-1217-CORE, Mil STD 1344A and VITA
47 environmental conditions.
There will be a number of sublevel standards. Chris Eckert is resuming
editorial duties for this effort. The group is considering removing
the AMC board edge notches and several mounting holes and, in addition,
is working on a generic connector description. This will allow press fit and surface mount solder
versions along with the current compression style. The board size is smaller
than AMC in order to fit onto VME boards. Other issues under consideration are front panel,
rail and board design, management schemes and I/O definition. See Presentation. |
|
VITA 57 Status |
Neil Harold, Nallatech |
This is a new mezzanine specification where the cards are
designed to fit onto 3U and 6U VME, cPCI, VPX, ATCA, AMC and PCI/PCIe
boards. The initial premise
involves 50 x 69mm cards on a 10mm stack height. Provisions for double
size boards, 50 x 139mm are also included. The connectors used are Samtec SAM Array and Sea Ray 160 and 400 pin
mezzanine style. See Presentation. |
|
VITA 58, Electronic Module Integration |
Mike Humphrey, AP Labs |
The VITA 58 committee, which addresses a modular
electronic packaging practice, has generated an enormous following. Initially envisioned
as pertaining to the military, it is also seen as being applicable to
other environment applications.
In addition to such other industries as seismic exploration,
industrial controls, transportation and medical, the linear accelerator
work being done by Stanford Linear Accelerator Center (SLAC) anticipates
that this standard will be extremely useful in their DoD funded 50
kilometer collider. The document
will standardize real world field line replaceable modules that
environmentally seal the electronics and allow easy module replacement
in non-user friendly environments.
A great deal of controversy was apparent at this meeting. This was primarily due to differing
opinions about the desired end product.
The group decided to prepare a list of concerns to send to the
requestors in an attempt to better understand the requirements. See Presentation. |
|
Other Business |
Valeria Andrews |
Valerie Andrews addressed the group about a request from
the Open Group software organization for a VITA hardware liaison. A volunteer is
being solicited. See Presentation. |
|
Adjourn VSO Meeting |
|
The main VSO meeting was adjourned at 2:10 PM. |
|
VITA 46 Working Group Meeting |
|
|
|
VITA 48 Working Group Meeting |
|
See VITA website for minutes of working group meetings. |
|
VITA 58 Working Group Meeting |
|
See VITA website for minutes of working group meetings. |