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The following are active projects within the VITA Standards Organization (VSO). Working groups are revising or creating these standards. This high-level update is based on the results of the most recent VSO meeting and is intended for the general non-member public. VITA Members can obtain members-only detailed status on each working group after logging into their account.
Contact VITA if you are interested in joining VITA and participating in any of these working groups. Visit Events for details on upcoming VITA meetings. If your company is not attending, you are missing an excellent opportunity to network, contribute and influence the future of VITA standards.
VITA 47.2-2019 Rev
Class 2 Requirements for Environments, Design and Construction, Safety, and Quality for VITA 47 Plug-In Modules Dot Standard
Abstract: The VITA 47 group of standards defines environmental, design and construction, safety, and quality requirements for commercial-off-the-shelf (COTS) Plug-In Modules intended for ground and aerospace applications. VITA 47.2 address requirements specific to dedicated service electronic products.
This revision enables a broader use of this standard across the COTS supplier market with added flexibility in environmental class options. It also corrects typographical errors, adds additional requirements for conformance to improve interoperability and maintainability, and rugged design for tactical applications.
Modules aligned to ANSI/VITA 47.1-2019, primarily Table 3.2-1, will not be aligned to the released ANSI/VITA 47.1-202X. To become compliant with this new update a supplier should revise their module datasheet with the new ANSI/VITA 47.1-202X, Figure 3.2 1 Environmental Class Code.
Status: This standard is undergoing revisions by the working group.
VITA 47.3-2019 Rev
Class 3 Requirements for Environments, Design and Construction, Safety, and Quality for VITA 47 Plug-In Modules Dot Standard
Abstract: The VITA 47 group of standards defines environmental, design and construction, safety, and quality requirements for commercial-off-the-shelf (COTS) Plug-In Modules intended for ground and aerospace applications. VITA 47.3 address requirements specific to high performance electronic products.
This revision enables a broader use of this standard across the COTS supplier market with added flexibility in environmental class options. It also corrects typographical errors, adds additional requirements for conformance to improve interoperability and maintainability, and rugged design for tactical applications.
Modules aligned to ANSI/VITA 47.1-2019, primarily Table 3.2-1, will not be aligned to the released ANSI/VITA 47.1-202X. To become compliant with this new update a supplier should revise their module datasheet with the new ANSI/VITA 47.1-202X, Figure 3.2 1 Environmental Class Code.
Status: This standard is undergoing revisions by the working group.
VITA 48.5-2010 (R2017) Rev
Mechanical Standard for VPX REDI AFT Cooling – Multi Pitch Air Flow Through Cooling, 1.52 "Pitch
Abstract: This standard establishes the design requirements for an air-flow-through (AFT) cooled plug-in unit. Unlike ANSI/VITA 48.1, which uses cooling air impinged directly upon the components and circuit boards, this plug-in unit uses a compact core heat exchanger located within the central heat sink of the unit and uses a 2- Level Maintenance qualified seal on the inlet and outlet of the heat exchanger eliminating any direct air contact with the PWB and components. This seal also provides ability for chassis level flow balancing allowing plug in units with varied cooling requirements in the same chassis. This standard defines both a 3U and 6U form factor, in various pitches as well as air inlet sizes providing a high-performance thermal solution for existing or new CCA designs.
Status: This standard is open for revisions to more clearly define some of the rules and recommendations. Verification method notation being added.
VITA 48.9-202x New
VPX AFT Cooling - Retractable Seals
Abstract: This standard defines an airflow through module format, 3U and 6U, that uses retractable module rack seals to improve module – chassis seal durability, simplifies the design by eliminating tapered module and chassis features, and allow easy migration of existing CCA designs to an air cooled module format.
Status: Working group is developing a draft document.
VITA 57.1-2019 RFM
FPGA Mezzanine Card (FMC) Standard
Abstract: This standard describes the compliance requirements for an FPGA Mezzanine Card (FMC) IO module which utilizes a mezzanine module to provide for a low overhead protocol bridge between a carrier card 's front panel IO and an FPGA processing device on the carrier card. This revision provides for larger EEPROMs, relaxes ground requirements, and allows for higher current on 3P3V AUX.
Status: This standard is under consideration for revision pending editing resource availability.
VITA 57.4-2018 RFM
FPGA Mezzanine Card Plus (FMC+) Standard
Abstract: This standard extends the VITA 57.1 FMC standard by specifying two new connectors that enable additional Gigabit Transceiver interfaces that run at up to 28Gbps. It also describes FMC+ IO modules which support this enhanced version of the FMC electro-mechanical standard. This is between the front panel IO, on the mezzanine module, and an FPGA processing device on the carrier card, which accepts the mezzanine module. Additional signals to support backplane reference clock and synchronization have been added. The VITA 57.4 specification is backwards compatible in that a VITA 57.4 carrier card can still support a VITA 57.1 FMC.
Status: This standard is under consideration for revision pending editing resource availability.
VITA 65.0-2023 Rev
OpenVPX System Standard
Abstract: The OpenVPX System Standard was created to bring versatile system architectural solutions to the VPX market. Based on the extremely flexible VPX family of standards, the OpenVPX standard uses Plug-In Module mechanical, connectors, thermal, communications protocols, utility, and power definitions provided by specific VITA standards to define a series of Slot, Backplane, Module, and Standard Development Chassis Profiles.
This revision adds additional communication protocols and Optical Profiles. There are also some clarifications made to the existing text. The associated [VITA 65.1] adds Connector Modules and Slot Profile dash options to support the new Optical Profiles as well as some other additions.
Status: ANSI/VITA 65.0-2025 is public comment phase.
VITA 65.1-2023 Rev
OpenVPX System Standard – Profile Tables
Abstract: This standard documents variations of Slot, Backplane, and Modules Profiles. As part of the Slot Profile Description, there are also some Connector Modules defined. This document is primarily tables which are referenced by VITA 65.0. (PDF and Excel versions available)
Status: ANSI/VITA 65.1-2025 is public comment phase.
VITA 67.3-2023 Rev
Coaxial Interconnect on VPX, Spring-Loaded Contact on Backplane
Abstract: This document describes an open standard of configuration and interconnect with the structure of VITA 67.0 enabling an interface compatible with VITA 46 containing multi-position blind mate analog connectors with coaxial contacts, having fixed contacts on the Plug-In Module and spring action on the backplane. This revision adds SMPS Gen2 contact interfaces to support radial alignment.
Status: ANSI/VITA 67.3-2023 was published in February 2024. Now open for modifications to SMPS interface.
VITA 78.0-2022 Rev
SpaceVPX System Standard
Abstract: This document describes an open standard for creating high performance fault tolerant interoperable backplanes and modules to assemble electronic systems for spacecraft and other high availability applications. Such systems support a wide variety of use cases across the aerospace community. This standard leverages the OpenVPX standards family and the commercial infrastructure that supports these standards. This next revision of the VITA 78.0 Standard updates the System Management section with respect to new content in VITA 46.11, adds new content on single string systems in addition to its current discussion on dual redundant, fully-fault tolerant, systems, additional communication protocols (such as PCIe), the addition of more specific mechanical and thermal content to provide guidance for flight systems, and, finally, the addition of more specific content on power architectures.
Status: The standard is open for revisions to the 2022 edition.
VITA 78.2-202x New
SpaceVPX System Standard – Profile Tables
Abstract: This standard documents variations of Slot, Backplane, and Modules Profiles. This document is primarily tables which are referenced by VITA 78.0.
Status: The working group has developed a draft document of the standard that is currently on hold by the working group.
VITA 89-202x New
MT Circular Connectors - Type 2
Abstract: Defines a standard for circular connectors with optical MT. Circular connector shells are compliant to MIL-STD-38999. MT offer options for up to 48 fibers per MT and for physical contact or lensed MT.
Status: VITA working group to develop a new standard for circular connectors with optical MT. Working group is developing draft document.
VITA 90.0-202x New
VNX+ Base Standard
Abstract: This document is the base standard for an Enhanced Small Form Factor System that meets the growing needs of improved Size, Weight and Power (SWaP) with a rugged, low cost, fast serial fabric interconnect based Plug-In Module. The VITA 90.x family of standards builds on the foundation established by VITA 74 VNX. VNX+ significantly increases performance and system versatility beyond VITA 74, while following its mechanical framework.
Status: Working group formed to make revisions to VNX under VNX+. Draft document nearing completion.
VITA 90.1-202x New
VNX+ Profile Tables
Abstract: This standard documents variations of Slot, Backplane, and Modules Profiles. This document is primarily tables which are referenced by VITA 90.0.
Status: Working group formed to make revisions to VNX under VNX+.
VITA 90.2-202x New
VNX+ Optical and RF Connector Modules - Type 2
Abstract: This standard defines the configuration of Optical and RF/Video Coaxial signals used for blind mating of Optical and RF/Video contacts in VNX+ systems.
Status: Working group formed to make revisions to VNX under VNX+. Draft document near completion.
VITA 90.3-202x New
VNX+ Power Supply and Storage Modules
Abstract: This standard defines the requirements to implement VNX+ compatible Power Conversion and Energy Storage Plug-In Modules in VNX+ systems.
Status: Working group formed to make revisions to VNX under VNX+. Draft document near completion.
VITA 90.4-202x New
VNX+ Cooling and Mounting Systems
Abstract: This standard defines alternate retention and thermal management system features in VNX+ systems. These features include wedge locks, heat pipes, mounting hardware, retention mechanisms, and chassis interfaces.
Status: Working group formed to make revisions to VNX under VNX+.
VITA 90.5-202x New
Space VNX+
Abstract: This standard defines a scalable, portable, resilient, and modular VNX+ Architecture used in small spacecraft.
Status: Working group formed to make revisions to VNX under VNX+ for development of a potential standard for space platforms.
VITA 90.7-202x New
VNX+ Optical and RF Connector Modules - Type 7
Abstract: This standard defines the configuration of Optical and RF/Video Coaxial signals used for blind mating of Optical and RF/Video contacts in VNX+ systems.
Status: Working group formed to define NanoRF coax/optical connector modules for VNX+.
VITA 91.1-202x New
System Standard for Higher Density VITA 46 Applications
Abstract: This standard defines a system definition that provides higher pin density to the backplane for VPX applications.
Status: VITA working group to develop a new standard for higher pin density for VPX. Project currently on hold.
VITA 92.0-202x New
High Performance Cable – Ruggedized 10 Gbaud Bulkhead High Speed, D- Sub, Rectangular Connector for Copper Cables
Abstract: This standard defines a rugged standardized 10 Gbaud interconnect system with a high pin count and high-density, light weight, rectangular connector (meets MIL-DTL-24308 physical envelope) for I/O. It can support multiple high bandwidth protocols and power while optimizing SWaP benefits in smaller systems with limited panel space availability.
Status: Working group is developing draft document.
VITA 93.0-202x New
QMC - Small Form Factor Mezzanine
Abstract: This standard, referred to as QMC, defines a Small Form Factor mezzanine that is significantly smaller than XMC with both a host and I/O interface connectors. The host interface supports modern high- speed serial fabrics. Multiple modules can be installed on various carrier card form factors including 3U/6U Eurocards (VPX, cPCI, VME, etc.), VNX+, PCIe expansion cards, and others. It is suitable for deployment in commercial, industrial, space, or military-grade rugged environments with air-cooled or conduction-cooled formats.
Status: Document is in the public comment phase.
VITA 94.0-202x New
Power Distribution Plug-In Module
Abstract: This standard provides requirements for building a power distribution Plug-In Module with digital controls that can be used in a VPX chassis. The Plug-In Module will fit within the standards envelope defined for VPX modules in the VITA 48.x standards.
Status: Working group is developing draft document.
VITA 95.0-202x New
Circular 38999 Connector with EBO Fiber Technology
Abstract: This document defines a standard for circular connectors with Expanded Beam Optical (EBO) ferrules. Circular connector shells are compliant to MIL-STD-38999 Series III. EBO ferrules are available in multimode or single mode.
Status: Working group is developing draft document.
VITA 96.0-202x New
Backplane Connectors with EBO Fiber Technology
Abstract: This document defines a standard for Backplane Connectors with Expanded Beam Optical (EBO) ferrules. EBO ferrules are available in multimode and singlemode.
Status: Working group is developing draft document.
VITA 100.00-202x-VDSTU New
VITA 100 Base Standard
Abstract: The VITA 100 suite of standards is an evolution to OpenVPX, VPX and related mechanical standards while embracing a paradigm shift in technology and capability with at least double the pin density, speed and power for electrical contacts. This document, the VITA 100.0 Baseline Standard, outlines the essential electrical and system architecture for the VITA 100 ecosystem.
Status: Working group is developing draft document.
VITA 100.10-202x-VDSTU New
VITA 100 Mechanical Common Base Standard
Abstract: The V100.10 standard defines common mechanical requirements for Plug-In Modules (PIM). Two types of Plug-In Modules are defined: Type 1 and Type 2. These types help PIM vendors to define rugged implementation, two-level maintenance, common components and other specifics that are applicable to all the V100.1X standards. There is also a suggestion for PIM vendors to design using a common Printed Wiring Board (PWB) size. This will allow for simple cooling method changes, using the same PWB, by changing the heat frame and cover designs.
Status: Working group is developing draft document.
VITA 100.11-202x-VDSTU New
VITA 100 Conduction Cooling ICD Standard
Abstract: This standard defines the mechanical requirements for conduction cooled (CC) Plug-In Modules (PIMs), Chassis ', and Backplanes in the V100 ecosystem.
Status: Working group is developing draft document.
VITA 100.20-202x-VDSTU New
System Management for VITA 100
Abstract: This document defines an architecture and implementation requirements for system management in VITA 100-based systems. It addresses both out-of-band and in-band system management across all operating states and enables system management interoperability within the VITA 100 ecosystem at the Field Replaceable Unit (FRU), chassis, and system levels.
Status: Working group is developing draft document.
VITA 100.30-202x-VDSTU New
Connectors for VITA 100 Applications
Abstract: This standard defines the connectors used in all the VITA 100 Standards. The VITA 100.30 connectors support higher pin density, speed and power for electrical contacts compared to the VITA 46 connectors. VITA 100 connectors are not intermateable to VITA 46 connectors.
Status: Working group is developing draft document.
VITA 100.31-202x-VDSTU New
VITA 100 Optical and Coaxial Connector Modules
Abstract: This standard defines the optical and coaxial interconnect for use in VITA 100 applications. The standard includes both the optical and coaxial contact interfaces and performance requirements, as well as connector module outline dimensions and backplane aperture sizes. The contact arrangements for a specific connector module are defined in VITA 100.1, along with the slot profiles that utilize them.
Status: Working group is developing draft document.
VITA 100.40-202x-VDSTU New
Advanced VPX Modular Power Supply Standard
Abstract: This standard provides requirements to build an Advanced VPX Power Supply Module that compliments and is compatible with the VITA 100 family of standards.
Status: Working group is developing draft document.